At this year's IC Packaging Technology Expo, DISCO will exhibit our latest core Kiru, Kezuru, Migaku solutions, including processes for TSV devices and LED substrates, wafer thinning and ultrahigh precision planarization equipment and our compact dual dicing saws.
DISCO will also be offering advice to customers at our process consultation counter.
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| Process Consultation Counter |
| Specialists will be available to discuss customers' inquires regarding Kiru, Kezuru and Migaku. |
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| Applications exhibit
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- TSV
- Wafer thinning
- LED
- Power devices
- High precision planarization
- Laser dicing
- Blade dicing
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| Tecnisco |
| TECNISCO LTD., our affiliate company, will display "Cross-edge" micro processing. |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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