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Thank you very much for taking the time to visit the DISCO booth.
Highlights
Laser technology for LED processes
Laser technology (ablation and Stealth Dicing) targeted for LED processing of sapphire substrates or heatsink materials and substrates with metal backsides.
Planarization technology for LED florescent resin
A process that stabilizes and controls the irregular color of LED using a surface planer.
TSV
Advances in Kiru, Kezuru, Migaku technologies for TSV with actual processed samples.
DAD3650
The new DAD3650 Ultracompact Dual-spindle Automatic Dicing Saw.
