GS08 series grinding wheels employ a new porous vitrified bond with excellent
swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard
SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be
performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier
compared to a slurry processes.
Features
Grinding with a fixed abrasive results in a surface roughness approaching a polish
Grinding can be performed on tape-mounted wafers for easy operation
Non-slurry process for a low environmental impact
Catalog Download
For the detailed specification and functions, view our catalogues.
