DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), completed construction of and relocated its Osaka Branch Office to a new building on November 15, 2023. Operations at this location will begin February 5, 2024.

Reason for Relocation to New Building

With its many electronic components and semiconductor manufacturers, the Kansai region is expected to generate high demand for DISCO technologies going forward as well, driven by the development of next-generation communication and self-driving technologies along with the need for carbon neutrality. In order to better provide extensive support for customer demands in this region, the Osaka Branch Office was relocated to a newly constructed building.

Overview of New Osaka Branch Office Building

Improved support for test cuts and KKM services with expansion of clean room floor space to 3x that of the old office

Improved BCM* responsiveness through adoption of a seismically isolated structure and solar power system

Expecting to increase the ratio of clean rooms as business expands

*BCM: Business Continuity Management

**Total floor space of the old office was approx. 1,370 m²

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About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.