Event Schedule

SEMICON KOREA

The highlights

  • Machines: DFD6363
  • SiC Solution
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Laser Processing
  • Power Device Processing
  • Narrow Street Solution (SDBG, DBG etc)
NEPCON JAPAN

The highlights

  • Electronic Component Processing
  • Advanced Package Processing
  • Power Device Processing
  • Laser Processing
  • Wafer Thinning Processing

Recommendation