Event Schedule

ICSCRM 2023

The highlights

  • KABRA, KABRA!zen
  • SiC wafer dicing and grinding
SEMICON Taiwan

The highlights

  • Machines:DFD6363,DWR1722,DFL7262
  • Consumable (Hub Blade, Hubless Blade, Wheel)
  • Laser Processing
  • Power Device Processing
  • Plasma Dicing
  • MUSUBI
  • Narrow Street Solution (SDBG, DBG etc)
SEMICON WEST

The highlights

  • Machines: DWR1722, RoofWay
  • Consumable (Hub Blade, Hubless Blade, Wheel)
  • SiC Solution
  • Wafer Thinning Processing
  • Laser Processing
SEMICON CHINA

The highlights

  • Machines: DFD6363, DFL7341, DDS2310, DDS2020
  • Consumable (Hub Blade, Hubless Blade, Wheel)
  • Laser Processing
  • Power Device Processing
  • Wafer Thinning Processing (SDBG)
  • Advanced Package Processing
LASER World of PHOTONICS

The highlights

  • SiC wafer processing
  • SiC ingot slicing by KABRA
  • Ablation laser grooving and full cut
  • Stealth laser dicing
  • LEAF, Laser Lift-Off, Via hole, Curvilinear processing
SEMICON Southeast Asia 2023

The highlights

  • Machines: DFD6755, DIS100
  • Consumable (Hub Blade, Hubless Blade, Wheel)
  • KKM for Packaging Process
  • SiC Solution
  • Laser Processing
  • Wafer Thinning Processing
SEMICON KOREA

The highlights

  • Machines: DFD6363
  • SiC Solution
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Laser Processing
  • Power Device Processing
  • Narrow Street Solution (SDBG, DBG etc)
NEPCON JAPAN

The highlights

  • Electronic Component Processing
  • Advanced Package Processing
  • Power Device Processing
  • Laser Processing
  • Wafer Thinning Processing

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