Event Schedule

SEMICON Europa 2022 (Co-located with electronica)

The highlights

  • Machines: DAD3360, DAG810, DWR1722, DIS100
  • SiC Total Solutions including KABRA, Grinding, E Pad Polishing and Dicing Methods
  • Ultra-thin Grinding for High Bump Wafers
  • Various Laser Processes
  • Thick PZT Dicing
SEMICON Taiwan 2022

The highlights

  • Machine: DFD6363, DWR1722, DIS100
  • Narrow Street Solution (MUSUBI, SDBG, DBG etc)
  • Laser Processing
  • SiC Solution
  • SECS/GEM
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
ICSCRM 2022

The highlights

  • SiC Total Solution
SEMICON West HYBRID

The highlights

  • Machine: DAD3221
  • Laser Processing
  • SiC Solution
  • Wafer Thinning Processing
  • Power Device Processing
SEMICON Southeast Asia 2022

The highlights

  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • KKM for Packaging Process
  • Laser Processing
  • Wafer Thinning Processing
  • SiC Solution
Laser World of Photonics

The highlights

  • KABRA
  • LLO
  • LEAF
  • SD
  • Laser Grooving and Plasma Dicing
  • SiC Solution
  • Consultation for KKM Service
SEMICON Korea 2022

The highlights

  • Machine: DWR1722
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Narrow Street Solution (MUSUBI, SDBG, DBG etc)
  • Laser Processing(Ablation , Stealth dicing)
  • Advanced Package Processing
  • SiC Solution

Recommendation