Event Schedule

IC China

The highlights

  • Machine: DIS100, DWR1722
  • Electronic Component Processing
  • Laser Processing
  • SiC processing
  • Wafer Thinning
SEMICON Southeast Asia 2021

The highlights

  • Machine: DFD6363 DBG ABC, MUSUBI, DWR1722, DIS100, Unitray, DFG8020, DFG8030
  • Precision Processing Tools(Hub Blades, Hubless Blades, Wheels)
  • KKM-Link
SEMICON China 2021

The highlights

  • Machine: DAD3221, DAD3350, DFD6363, DFG8640, DFL7161, DIS100, DWR1722
  • Wafer Thinning
  • Laser Processing
  • Power Device Processing
  • Electronic Component Processing
NEPCON Japan
  • Date: January 20-22, 2021

The highlights

  • DISCO has decided to cancel participation in the next INTERNEPCON Japan to be held at Tokyo Big Sight (January 20–22, 2021) in consideration of the health of both customers and employees during the COVID-19 pandemic.

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