Event Schedule
- ICSCRM 2023
- Date: September 17 - 22, 2023
- Venue: Hilton Sorrento Palace (Sorrento, Italy)
- Official website: https://icscrm-2023.org/
The highlights
- KABRA, KABRA!zen
- SiC wafer dicing and grinding
- SEMICON Taiwan
- Date: September 6 - 8, 2023
- Venue: Taipei Nangang Exhibition Center
- Official website: https://www.semicontaiwan.org/
The highlights
- Machines:DFD6363,DWR1722,DFL7262
- Consumable (Hub Blade, Hubless Blade, Wheel)
- Laser Processing
- Power Device Processing
- Plasma Dicing
- MUSUBI
- Narrow Street Solution (SDBG, DBG etc)
- SEMICON WEST
- Date: July 11-13, 2023
- Venue: Moscone Center (San Francisco)
- Official website: https://www.semiconwest.org/
The highlights
- Machines: DWR1722, RoofWay
- Consumable (Hub Blade, Hubless Blade, Wheel)
- SiC Solution
- Wafer Thinning Processing
- Laser Processing
- SEMICON CHINA
- Date: June 29-July 1, 2023
- Venue: Shanghai New International Expo Centre (Shanghai)
- Official website: https://www.semiconchina.org/en
The highlights
- Machines: DFD6363, DFL7341, DDS2310, DDS2020
- Consumable (Hub Blade, Hubless Blade, Wheel)
- Laser Processing
- Power Device Processing
- Wafer Thinning Processing (SDBG)
- Advanced Package Processing
- LASER World of PHOTONICS
- Date: June 27-30, 2023
- Venue: Messe München (Germany)
- Official website: https://world-of-photonics.com/en/
The highlights
- SiC wafer processing
- SiC ingot slicing by KABRA
- Ablation laser grooving and full cut
- Stealth laser dicing
- LEAF, Laser Lift-Off, Via hole, Curvilinear processing
- SEMICON Southeast Asia 2023
- Date: May 23-25, 2023
- Venue: Setia SPICE Convention Centre,Penang, Malaysia.
- Official website: https://www.semiconsea.org/
The highlights
- Machines: DFD6755, DIS100
- Consumable (Hub Blade, Hubless Blade, Wheel)
- KKM for Packaging Process
- SiC Solution
- Laser Processing
- Wafer Thinning Processing
- SEMICON KOREA
- Date: February 1-3, 2023
- Venue: COEX Hall A, Seoul
- Official website: https://www.semiconkorea.org/en
The highlights
- Machines: DFD6363
- SiC Solution
- Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
- Laser Processing
- Power Device Processing
- Narrow Street Solution (SDBG, DBG etc)
- NEPCON JAPAN
- Date: January 25-27, 2023
- Venue: Tokyo Big Sight, Tokyo
- Official website: https://www.nepconjapan.jp/tokyo/en-gb.html
The highlights
- Electronic Component Processing
- Advanced Package Processing
- Power Device Processing
- Laser Processing
- Wafer Thinning Processing