DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed DIS100, a unit that picks up die from the wafer after dicing and measures die thickness, chipping, backside surface roughness, and die strength* fully automatically. Efficient and highly accurate measurement is achieved by automating all of the existing manual processes.
In addition, DIS100 records measurement data. Therefore, it also improves traceability, as required in quality audits of automotive devices.
* Die strength
The largest stress when the die is bent until it breaks. The higher the die strength is, the less die breakage occurs, which contributes to improved yield and reliability for the final devices.
From a safety perspective, quality management is especially important for automotive devices, for which demand is increasing due to the development of self-driving and electric vehicles. In addition, high die strength is required for die used in memory devices, which are continually becoming thinner with storage capacity becoming larger.
Because there was no equipment to automatically measure die thickness, chipping, backside surface roughness, or die strength, there were issues caused by manual operation, including measurement variation and high inspection labor costs.
DIS100 achieves stable fully automatic die strength measurement and efficient die quality management.
After the user simply sets a frame cassette to DIS100 after dicing, DIS100 automatically picks up the designated die, measures die thickness, chipping**, backside surface roughness, and die strength (breakage test), and monitors the conditions when the die breaks using a high-speed camera***.
At automotive device manufacturers, demand is increasing for die storage in addition to quality recording for improved traceability.
DISCO UNITRAY specification achieves compact storage by placing the designated die on a UNITRAY, specially developed by DISCO, after sidewall and backside measurement.
Management information, including wafer lot number, is converted into a bar code so that die can be managed through tray labeling. It is possible to access the die data easily by scanning the bar code.
UNITRAY is a tray for IC chips that was designed by DISCO. Its dimensions are equal to those of the JEDEC tray.
The weak adhesive gel sheet attached on the entire surface of a UNITRAY secures the die. It can be used repeatedly upon cleaning.
(resolution: 0.2 μm)
Chipping measurement on front/backside surface
(width: 1 μm or more)
Surface roughness measurement on ground surface
Frame rate: 400,000 frames/s
(Max. rate: 2,000,000 frames/s)
Available for purchase
About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.