Decision to Begin Construction on Sept. 8 for Osaka Branch Office Relocation
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Headquarters: Ota-ku, Tokyo, President: Kazuma Sekiya), has decided to construct a new office for the relocation of operations from the Osaka Branch Office. Construction starts September 8, 2022, and relocation is planned for November 2023.
Background behind New Building Construction and Relocation
Many electronic component and semiconductor manufacturers are based in the Kansai area, which is the location of the Osaka Branch, and DISCO technologies are expected to be in high demand going forward due to the development of next-generation communication and self-driving technologies along with the need for carbon neutrality. In order to support these customers’ wide range of needs, including test cuts, KKM services, and after maintenance, it has become necessary to expand the floor space of this branch office.
Therefore, DISCO has decided to construct a new building and relocate operations to this new office in order to enhance personnel systems and facilities for the future.
Overview of New Osaka Branch Office Building
| Address | 3-16, 3 chome, Semba Higashi, Minoh-shi, Osaka |
|---|---|
| Site area | 2205.98 m² |
| Building structure | Six-story steel-framed building (seismically isolated structure) |
| Total floor space | 8634.60 m² ※1 ※2 |
| Construction cost | Approx. 2.3 billion yen※3 |
| Construction start | September 8, 2022 |
| Construction completion | November 2023 |
※1：Upon completion, some floors will be leased to outside companies. The percentage of floor space used by DISCO will be increased as needed with the expansion of business.
※2：s reference, the total floor space of the current Osaka Branch Office is approx. 1,370 m²
※3：This construction will have minimal impact on full-year consolidated business results for the fiscal year ending March 2023 (FY2022).
About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.
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