DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFD6363, a fully-automatic blade dicing saw capable of processing Φ300 mm Si wafers. DFD6363 is the improved process adaptability version of DFD6362, which has been widely adopted for use in semiconductor manufacturing with Φ300 mm Si wafers. This equipment will be exhibited at SEMICON Japan 2018 (December 12 to 14 at Tokyo Big Sight).
The semiconductor market is expected to expand due to the development of IoT and AI, the rise in
electric vehicles, and the increasing demand for server storage due to the increase in communication
data. In response to Φ300-mm Si wafer mass production demands, DISCO provided DFD6362 and DFD6361,
which are now in operation at semiconductor manufacturers worldwide.
However, there is further demand for improvements in productivity as a result of recent progress in the diversification of the semiconductor manufacturing process. In order to meet these demands, DFD6363 was developed and added to our blade dicing saw lineup.
|December 2018||Exhibition at SEMICON Japan 2018|
|October 2019||Plan to start selling|
※1 Available as an optional feature.
※2 The DBG process (Dicing Before Grinding) is the reverse of the conventional process of grinding first, then singulating the wafer. A wafer is half cut first, and then the wafer is singulated into die by grinding the wafer. Because the risks of backside chipping during die separation and wafer breakage can be prevented, it has been widely adopted for memory production with Φ300-mm wafers.