DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed "MUSUBI", a cluster system*1 featuring efficient wafer transfer and reduced wafer breakage risk, accomplished by connecting multiple equipment units as necessary for the manufacturing process. DISCO has also developed DMG8762 (grinder/polisher), DME8061 (dry etcher), and DMM9200 (wafer mounter), which are compatible with this cluster system. These three equipment models will be connected through MUSUBI and displayed at SEMICON Japan 2019 (December 11 to 13, Tokyo Big Sight).
*1 Cluster system: An equipment configuration adopted mainly for front-end processes in semiconductor manufacturing. A cluster system has multiple process chambers and unloads wafers to the cassette after completing all processes, rather than after each process. Based on this concept, this cluster system, named “MUSUBI,” has been developed for and applied to back-end processes.
In recent years, the need for greater cloud server capacity has increased in response to the spread of mobile devices, leading to an increase in demand for NAND flash memory and DRAM. Stacking thin die is the main method for increasing memory capacity, and at manufacturing sites, a variety of manufacturing processes, including DBG*2 and SDBG*3, have been adopted in addition to the conventional process, which singulates wafers into die after backgrinding. Further demand for thinning is expected to increase as 5G and IoT evolve. In addition, there has been an increase in demand for flexibility in various processes and for improvement in productivity. To respond to this demand, DISCO has developed a cluster system with a new transfer system—"MUSUBI."
*2 DBG: Dicing Before Grinding, which is a processing method that first half-cuts a wafer
and then separates the wafer into die during backgrinding
*3 SDBG: Stealth Dicing Before Grinding, which is a processing method that first performs stealth dicing, which forms an SD layer in a wafer by focusing the laser inside the wafer, and then separates the die during backgrinding.
*4 UPH: Units Per Hour, indicating the number of mirror wafers processed per hour under DISCO’s recommended conditions.
In grinding, wafers are thinned after backgrinding tape (BG tape) is mounted to protect the pattern side. Then, due to the difficulty of handling thinned wafers, the BG tape is peeled after the thinned wafer is mounted onto dicing tape with a dicing frame, and the dicing frame is then transferred. The wafer mounter DMM9200 performs the tape peeling and mounting procedure automatically.
|Exhibited at SEMICON Japan 2019||December 11 – 13, Tokyo Big Sight|
|Test cuts||Now accepting requests|
|Sales release for MUSUBI, DMG8762, and DMM9200||Available for purchase|
|Sales release for DME8061||August 2020|
※ Equipment notations in this press release were revised due to changes in equipment names (Dec. 7th, 2020).