DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFG8541, a fully automatic grinder that can process Si (silicon) and SiC (silicon carbide) wafers up to a maximum size of ø8 inches.
The actual equipment will be exhibited at SEMICON Japan 2022 (to be held from December 14th to 16th at Tokyo Big Sight).
In response to demands for grinding wafers smaller than Φ8 inches in the semiconductor market, DISCO has been providing DFG8540, a fully automatic grinder. DFG8540 has been shipped to many device manufacturers and electric component manufacturers as a standard dual-axis grinder.
On the other hand, two decades have passed since the initial release of DFG8540, and customers’ processing targets have expanded from not only Si, but also to composite semiconductors including SiC. In addition, with growing needs for wafer thinning along with the development of high-density packaging technologies, maintaining higher cleanliness inside the equipment is now required in order to reduce breakage risks caused due to the adherence of particles during the processing, transferring, and cleaning processes.
In light of this, DISCO has developed DFG8541, the successor equipment to DFG8540, aiming for stable thinning while maintaining high cleanliness as well as improved operability and productivity. By making a high torque spindle an option, it is possible to support difficult-to-process materials that have high rigidity such as SiC, responding to the SiC power semiconductor manufacturing needs that have been growing due to the global movement toward decarbonization.
Prevents the adherence of particles inside the equipment and reduces the breakage risk of thin wafers by adopting the following functions
*1 : A cleaning method where mist generated by mixing fluid droplets with blasts of air is sprayed against the cleaning surface at high speeds. The resulting shockwave and expansion wave enable strong cleaning with minimal damage.
Reduces breakage risks of high-cost wafers such as developmental products, cutting-edge products, and SiC
By adopting a built-in vacuum pump, the footprint has been reduced by 15% compared to that of DFG8540.
By adopting a new bearing structure, air consumption is reduced by approx. 50% compared to that of DFG8540. DFG8541 also contributes to energy saving of plant facilities (compressors).
|Supported workpiece size||Φ100–200 mm|
|Structure||Dual spindle (processing axes), three chuck tables|
|Grinding method||In-feed grinding through workpiece rotation|
|Spindle||Rated output: 4.2 kW (option: 6.3 kW)|
|Rotation speed range: 1,000–7,000 min-1|
|Equipment dimensions||(W) 1,100 x (D) 2,800 x (H) 1,800 mm|
|Equipment weight||2,900 kg|
|Exhibited at SEMICON Japan 2022||December 14–16, 2022|
|Sales start||June 2023|
About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.
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