DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed DFG8640, a fully automatic grinder compatible with Φ8-inch wafers and able to grind a wide variety of materials, including Si (silicon), LiTaO3 (LT/lithium tantalate), LiNbO3 (LN/lithium niobate), and SiC (silicon carbide). DFG8640 will be exhibited at SEMICON Japan 2018 (held at Tokyo Big Sight from December 12 to 14.)
DFG8640 fulfills these needs and achieves a small footprint and further productivity improvement.
|Exhibited at SEMICON Japan 2018||December 12 – 14 (Tokyo Big Sight)|
|Test cuts||Now accepting requests|
|Equipment release||January 2019|