DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing
equipment manufacturer, has developed DDS2320, a fully automatic die separator capable of processing Φ300
mm wafers that contributes to improved throughput and reliability in memory production.
This equipment will be exhibited at SEMICON Japan 2019 (December 11 to 13, Tokyo Big Sight).
Memory demand is expected to increase with the development of IoT, AI, and ADAS. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past. While DISCO had previously introduced the die separator* DDS2300 to the market, DD2320 has been newly developed to meet these emergent needs.
* Die separator: Equipment used to singulate die from workpieces attached to dicing tape. First, die attach film, which is used to mount and laminate thin die, or a wafer with an internal SD layer formed after laser stealth dicing is attached to the tape. Then, the die are singulated by expanding the tape.
Efficient production of thin die is now possible due to the adoption of a newly developed expansion unit.
Particle adhesion is reduced by performing processing and transfer after reversing the workpiece, leading to improved device reliability and yield.
In previous models, auxiliary equipment was installed in the area around the main equipment. DDS2320 achieves a smaller footprint by having the auxiliary equipment installed internally.
|Exhibited at SEMICON Japan 2019||December 2019|
|Sales release||July 2020|