Application processing examples
We have introduced dry polishing as a stress relief method for the DBG (Dicing Before Grinding) process. While satisfying both a reduction in environmental burden by being chemical-free, a feature of dry polishing, and the easy operation compared to the process using a slurry, high die strength can be realized.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.