*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
DFL7161 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
Maximum speed is increased through improved transfer and processing axis performance, achieving higher productivity.
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
|Max. workpiece size||mm||Φ300|
|Moving speed||mm/s||1 ～ 1,000|
(Single error) 0.002/5
|Max. rotating angle||deg||330(standard)
|Machine dimensions (W×D×H)||mm||1,560 × 1,550 × 1,800|
|Machine weight||kg||Approx. 2,300|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.