Application processing examples
The simultaneous multiple-piece grinding using the frame chuck is introduced this time.
Mount multiple workpieces on the tape affixed to the dicing frame, secure it to the DAG810 chuck table and perform grinding.
Various workpiece shapes such as small round, oval and rectangular are applicable. (Either the 8- or 12-inch chuck table can be selected.)
Workpiece (molded die) largely warped due to the stress that occurred during resin coating after packaging, a quartered Si wafer, Si die, LT package substrate, gallium arsenic base, sapphire base, etc.
This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.