In addition to dicing saw and laser saw applications, DISCO is also proposing various applications based on the waterjet saw (Product name: DAW4110). In the DAW4110, abrasive material, which is discharged from a nozzle together with pressurized water, is used to cut the workpiece.
Since the loose abrasive material impacts the workpiece and performs cutting, processing heat due to friction does not occur. This is effective in materials where cutting defects easily occur due to processing heat.
In contrast to blade processing, which makes a straight line cut in the workpiece, the waterjet from the nozzle makes a hole in the workpiece. Therefore, it is possible to precisely cut a workpiece at a programmed outline like a curvilinear processing.
The DAW4110 employs an AWSJ* system, therefore, it is possible to process at low water pressure compared to generic waterjet equipment. As a result, the DAW41110 is able to adapt to numerous material types, such as thin, brittle materials, flexible materials and laminated materials.
* AWSJ : Abrasive Water Suspension Jet. Compared to AWIJ (Abrasive Water Injection Jet), which is the most prevalent system, the AWSJ can process at low water pressure. DISCO has realized an AWSJ system by developing original technology to stabilize the concentration of the abrasive.
To efficiently use the abrasive material, the DAW4110 employs a system to collect and recycle the unworn abrasive in the water.
Precise non-thermal curvilinear processing of various materials is possible as shown in the below
(from the top left going clockwise: Copper, Silicon, Aluminum, SUS, glass, glass epoxy resin)
Please feel free to contact us with any questions or inquiries.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.