Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 blades. The ZHRF series minimizes blades slant cutting and achieves stable processing results even under high load conditions such as high speed processing, thick wafer cutting, or when cutting wafers with a large amount of metal on the streets. In addition, by combining ZHRF blades with laser grooving to process wafers with low dielectric constant (Low-k) layers, backside chipping and peeling are eliminated, and high speed processing is possible.
The ZHRF Series better controls slant cutting even under high processing loads and enables more stable processing compared to the previous blade series due to the improved blade strength.
Compared to the previous series, the ZHRF Series shows improved strength
|Workpiece||Si + Cu layer 2 µm|
|Depth||200 µm (half cut)|
The ZHRF Series controls wavy cutting and slant cutting under high load and high rotation speed conditions. This makes stable processing possible.
|Depth||400 µm (half cut)|
|Spindle revolution||55,000 min-1|
・This evaluation was intentionally conducted under conditions which tend to generate wavy cutting.
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When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.