Applications: Composite materials (Silicon + glass wafer etc), SiC, Ceramics, etc
The ZP07 series combines high cutting ability that is specific to electroplated bond blades and appropriate self sharpening ability by forming pores in the electroplated bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult-to-cut using the conventional electroplated bond.
New type of electroplated blade with pores in the blade.
The ZP07 series can process bonded wafers (silicon + glass) in one pass and can achieve high-grade results on the silicon, glass, and bonded surfaces.
|Workpiece||Si 0.5 mmt + Glass 0.5 mmt|
|Spindle revolution||30,000 min-1|
|Size||56 x 0.1 x 40 mm|
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.