While offering an even more compact footprint than the existing DAD3350, workpieces of sizes up to Φ300 mm are now supported. Furthermore, a high output 1.8 kW spindle is now available as a standard option. The DAD3360 can cut not only silicon wafers, but also products of a variety of sizes and materials, such as large package substrates, electronic parts including SAW filters, and more.
Like its predecessors, the DAD3360 has a wide selection of options available to improve processing quality, to reduce running cost, and to improve its ability to process hard-to-cut materials.
Stable processing is maintained due to the use of a bridge-type frame structure, which is highly effective at suppressing thermal expansion and vibrations, to provide the forward support for the spindle. Additionally, this allows the movement speed of each axis to be increased to provide high processing throughput.
An LCD touch panel with a GUI (graphical user interface) is included. Processing conditions,
equipment status, and more is all presented visually. Operating the equipment is simple and needs
nothing more than a simple touch of the icons on the interface.
In addition, XIS mode (Extended Interface System mode) which is a feature of the DFD6000 series is included as a standard option. Commonly used features such as light level adjustment, focus adjustment, and screen movement are all gathered on one screen providing a boost to efficiency.
Aligns the substrate using multiple alignment points to allow for high precision even when processing substrates made of materials such as resin which have irregular expansion and contraction
A high torque and high rigidity 2.2 kW spindle can be selected as an option which offers a maximum Φ5-inch blade size and makes processing applications which require a heavy load on the blade possible. This includes processing of fused quartz, ceramics and other hard to cut materials, processing workpieces with a thickness of more than 3 mm, and grooving with a thick blade.
Multi-wafer support gives the DAD3360 the ability to process multiple package substrates on one tape frame (supports a maximum of 16 wafers)
|Specification||Unit||1.8 kW||2.2 kW|
|Max. workpiece size||mm||Φ300 (250 mm × 250 mm user-specified specification)|
|Cutting speed||mm/s||0.1 ～ 1,000|
|Index positioning accuracy||mm||0.002/310
(Single error) 0.002/5
|θ-axis||Max. rotating angle||deg||320|
|Revolution speed range||min‐1||6,000 ～ 60,000||3,000 ～ 30,000|
|Machine dimensions(W×D×H)||mm||880 × 1,000 × 1,800|
|Machine weight||kg||Approx. 1,100|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|
|490 × 870 × 1,600||490 × 870 × 1,670||500 × 900 × 1,670||490 × 870 × 1,670||730 × 900 × 1,670||650 × 950 × 1,670||650 × 950 × 1,600||650 × 950 × 1,670||900 × 1,050 × 1,800||880 × 1000 × 1,800||880 × 1,000 × 1,800||730 × 900 × 1,670||730 × 900 × 1,670||790 × 790 × 1,890||790 × 790 × 1,800||1,350 × 1,200 × 1,890||1,350 × 1,200 × 1,800|