Application processing examples
Up until now a process called ring grinding has been used to remove the ring left over from TAIKO grinding. We have now developed a process of ring removal by circle cutting with a blade dicer.
For details, please contact the Application R&D Division.
Please feel free to contact us with any questions or inquiries.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.