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The process of ring removal for TAIKO wafer by circle cutting

Application processing examples

Up until now a process called ring grinding has been used to remove the ring left over from TAIKO grinding. We have now developed a process of ring removal by circle cutting with a blade dicer.

Advantages of ring removal by circle cutting

  • A simplified process with less tape mounting compared to the ring grinding process
  • Frame handling reduces the risk of breakage when handling thin wafers

Introduction to the TAIKO ring removal process

For details, please contact the Application R&D Division.


Please feel free to contact us with any questions or inquiries.