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Thick Wafer Dicing Using Blade Dicing Saws

Application processing examples

Though blade dicing saws are generally used to singulate wafers, they are also able to process thick substrates when installed with a user-specified specification.

Processing Example

The following is a photograph of 60 mm deep grooving into a soda-lime glass block using a blade dicing saw.
DISCO responds to customers’ varied needs with customized solutions by utilizing the manufacturing technology of its equipment and consumables.

Processing Example
Sample Size(WxDxT) :40x15x70 mm
Cutting Depth : 60 mm

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