Application processing examples
The dicing saw is normally used to cut a workpiece into die, but it can also perform profiling by utilizing the shape of the blade.
The photograph shows the result when grooving silicon (Si) into pillars 1 µm square with a height of 30
This can be realized only when the machine operation is highly accurate and process damage caused by the blade is at its minimum.
Profile processing can be used when producing microparts and testing samples.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.