Application processing examples
The measurement alignment is the action to detect the processing position of a product whose expansion/shrinkage is large, such as a substrate.
Note: In addition to the method which detects all the alignment marks as shown above, there is the method which shortens the alignment time by only using the alignment marks at the edge of the workpiece (see Figure 3). In this case, the alignment marks measured are equally divided and the die interval (index) and inclination (θ) are adjusted to obtain the processing positions.
DISCO proposes a broad range of alignment methods that are suitable to the workpiece conditions. For details, please feel free to contact us.
Please feel free to contact us with any questions or inquiries.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.