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Countermeasure for Preventing Particle Adhesion in Die LED Processing

Application processing examples

One of the concerns when dicing die LED is the deterioration of brightness caused by adhesion of particles on the silicon resin section.
StayClean-A is very effective for preventing such particle adhesion.

Practical Example

Die LEDs have the following configurations.

  • Dome type

    Aims at diffusing light
    Usage: Lighting, etc.

    Dome type
  • Flat type

    Focuses on light extraction efficiency and stability
    Usage: Backlight

    Flat type

Use of StayClean-A in the die LED dicing enables preventing particle adhesion on the silicon resin section, thereby reducing the deterioration of the brightness.

Coolant used Before processing After processing
D.I. water
D.I. water +

Silicon resin surface photographs (DISCO internal test results)


Please feel free to contact us with any questions or inquiries.