Application processing examples
CP alignment (Characteristic point alignment) is the function which recognizes the target based on its profile and conducts matching. This is effective when alignment is difficult by the conventional method which recognizes the target based on the contrast.
(Reference photographs: Si 300 µm thick + Si 300 µm thick bonded wafer)
(Reference photographs: Terminal on a package substrate)
As shown below, depending on the condition of the scratches and foreign matter, there is a case where alignment may be unstable.
Target can be recognized
There is a scratch/foreign matter on the target profile
This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.
Please feel free to contact us with any questions or inquiries.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.