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Corporate Outline

CP alignment

Application processing examples

CP alignment (Characteristic point alignment) is the function which recognizes the target based on its profile and conducts matching. This is effective when alignment is difficult by the conventional method which recognizes the target based on the contrast.

Examples

Example 1 : Workpiece in which sufficient contrast cannot be obtained by light level adjustment

(Reference photographs: Si 300 µm thick + Si 300 µm thick bonded wafer)

  • Currently

    Target cannot be recognized due to insufficient contrast
    Target cannot be recognized due to insufficient contrast
  • CP alignment

    Target can be recognized
    Target can be recognized

Example 2 : Workpiece with many scratches and foreign matter on the target

(Reference photographs: Terminal on a package substrate)

  • Currently

    Target cannot be recognized due to roughness and scratches
    Target cannot be recognized due to roughness and scratches
  • CP alignment

    Target can be recognized
    Target can be recognized

<Caution>
As shown below, depending on the condition of the scratches and foreign matter, there is a case where alignment may be unstable.

  • Target can be recognized

    There is a scratch/foreign matter inside the target
    There is a scratch/foreign matter inside the target
  • There is a scratch/foreign matter on the target profile

    There is a scratch/foreign matter on the target profile
    There is a scratch/foreign matter on the target profile

This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.

Contact

Please feel free to contact us with any questions or inquiries.

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